| http://www.w3.org/ns/prov#value | - ving leads reached by vias through passivation covering access planeUS5751031Apr 28, 1997May 12, 1998Micron Technology, Inc.Memory and other integrated circuitry having a conductive interconnect line pitch of less than 0.6 micronUS5904556Jan 11, 1996May 18, 1999Hitachi, Ltd.Method for making semiconductor integrated circuit device having interconnection structure using tungsten filmUS6078100 *Jan
|
