| http://www.w3.org/ns/prov#value | - of an exemplary method used to fabricate the semiconductor package of the first embodiment shown in FIGS. 2A and 2B; FIG. 10 is a top plan view of a leadframe used to fabricate a semiconductor package constructed in accordance with a fifth embodiment of the present invention; FIG. 11A is a cross-sectional view of the semiconductor package of the fifth embodiment; FIG. 11B is a bottom plan view of
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