| http://www.w3.org/ns/prov#value | - However, if the recessed alignment marks are formed in a damascene formed layer, such as conductive lines or vias formed in an insulating layer, and the insulating layer is subjected to a chemical mechanical polish (CMP) process, (as is typical to remove excess conductive material from the top surface of the insulating layer to form the conductive lines or vias) the edges of the alignment marks be
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