| http://www.w3.org/ns/prov#value | - The ESiP research group claims they have developed basic technologies that enable the integration of various types of chips in the smallest volume SiP packages.For example, customer-specific processors with the latest CMOS technologies, light-emitting diodes and DC-DC converters, MEMS and sensor components and passive components such as miniaturized capacitors and inductors, they explained.
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