| http://www.w3.org/ns/prov#value | - providing a first low-k dielectric layer on a substrate having at least one opening, said opening including a via hole which exposes an underlying metal layer surrounded by said first low-k dielectric layer, said first low-k dielectric layer having an etch stop layer formed thereupon, and a trench over said via hole surrounded by a second low-k dielectric layer;
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