About: http://webisa.webdatacommons.org/140951126

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 9A is a plan view of a bumped die having bumps of conductive adhesive deposited in a pattern on each of the interconnect pads by using one of the printheads of FIGS. 3 and 4;
http://www.w3.org/ns/prov#wasQuotedFrom	google.com