About: http://webisa.webdatacommons.org/154801985

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The embodiment shown in FIG. 5 is an example of the present invention when ball bonding technology is used to interconnect the semiconductor chip to the substrate.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com