| http://www.w3.org/ns/prov#value | - t of improving moisture tolerance and flexural strength of the insulation substrate or the coating material.The insulation substrate or the coating material for a semiconductor device of this embodiment contains, besides the above-mentioned imparting agent, a resin such as an epoxy resin or a phenolic resin, various additives and the like.The additive includes, for example, 2-ethyl-4-methylimidazo
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