| http://www.w3.org/ns/prov#value | - Further, a substrate 3 composed of plastic such as a glass epoxy or the like, or ceramic which is reduced by about 0.5 mm to 2.0 mm in thickness as compared with the semiconductor element 1 with soldering balls 4 formed on one surface thereof, is fixed to the semiconductor element 1 with the adhesive layer 2 interposed therebetween.
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