| http://www.w3.org/ns/prov#value | - Next, as shown in FIGS. 3B and 4D, secondary sealing resin 10 made of non-conductive liquid resin material mainly composed of thermosetting resin, such as epoxy resin, is applied to cover at least a part of each of first semiconductor chip 3 and second semiconductor chip 4, a part of circuit board 2, and wire 12 by a dispenser or injection unit (not illustrated).
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