| http://www.w3.org/ns/prov#value | - As noted above, the mating component 20 may include, for example, a semiconductor device such as another semiconductor die or a carrier substrate including, for example, a printed circuit board (PCB) formed, for example, of bismaleimide-triazine (BT) resin, an FR-4 or FR-5 laminate, silicon, or other suitable material or combination of materials as known in the art.
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