PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • As shown in an embodiment of the present invention in FIG. 1, an electrical component, such as an enclosure, board, package, or chip 100, may dissipate excessive heat to create a hot spot 101.
http://www.w3.org/ns/prov#wasQuotedFrom
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