| http://www.w3.org/ns/prov#value | - An integrated circuit assembly comprising:(a) a lead frame including a die attach pad and a plurality of bonding fingers positioned proximate to said die attach pad; (b) interposer means including(i) a thin, flexible, planar insulator having a first side attached to said die attach pad; and (ii) a plurality of substantially planar conductive traces provided on a second side of said insulator which
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