| http://www.w3.org/ns/prov#value | - FIG. 38A is a plan view of a second variation of the resin-encapsulated semiconductor device of the third embodiment, FIG. 38B is a cross-sectional view of the second variation when a lead frame that has been subjected to step processing is used, and FIG. 38C is a cross-sectional view of the second variation when a lead frame that has been subjected to step processing and tapered step processing i
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