| http://www.w3.org/ns/prov#value | - BRIEF DESCRIPTION OF THE DRAWINGS [0058]FIG. 1 is a schematic side view of a ball bump with an interconnecting wire; [0059]FIG. 2 is a top schematic view of a 3D image of leads and defects in a tray using only triangulation and illustrating an error caused by tray wall reflection; [0060]FIG. 3 is a side schematic view of a specular solder ball on a wafer and illustrating the ball's imaging geometr
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