| http://www.w3.org/ns/prov#value | - The bottom shield layer 3 is formed through sputtering or plating. [0071] Next, on the bottom shield layer 3, a bottom shield gap film 4 made of an insulating material such as Al2O3 or SiO2 and having a thickness of 10 to 200 nm, for example, is formed through sputtering, for example.
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