| http://www.w3.org/ns/prov#value | - The package body need not surround the integrated circuit(s) or semiconductor chip(s) completely, leaving one or more sides, edges, surfaces, or other regions of the integrated circuit(s) or semiconductor chip(s) exposed, but a large majority of package bodies in CSP technologies completely encase the integrated circuit(s) or semiconductor chip(s) or leave only the terminals on integrated circuit
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