| http://www.w3.org/ns/prov#value | - Through holes for establishing connection with the diffusion layers and the electrode, and the like are formed therein, and are filled with tungsten, polysilicon, or other conductives to form contacts 7 a and 7 b. [0041] In this embodiment, as shown in FIG. 3C, a first heat treatment is performed here in a hydrogen atmosphere or a nitrogen- or otherwise-diluted hydrogen atmosphere at 300-500??? C.
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