| http://www.w3.org/ns/prov#value | - The etch mixture can be KOH-based or more preferably KOH-based solution with excess isopropanol at 70??? C., or most preferably KOH-based solution with excess isopropanol at 70??? C. and oxidizing agents such as sodium peroxydisulfate, sodium periodate, or gaseous, bubbled molecular oxygen.
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