| http://www.w3.org/ns/prov#value | - the second polishing unit 1 b to remove the Cu layer 31 and the barrier metal layer 32 until the oxide film (SiO2) 33 is exposed in regions other than portions where the Cu layer 31 is formed in the wiring grooves 30 a and 30 b, as shown in FIG. 6(c).
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