| http://www.w3.org/ns/prov#value | - low through or into via holes, vents and other openings or recesses that communicate with surfaces of substrates of semiconductor device componentsUS8328942 *Dec 17, 2004Dec 11, 2012Lam Research CorporationWafer heating and temperature control by backside fluid injection* Cited by examinerClassifications U.S. Classification134/199, 134/902, 134/56.00R, 134/200, 134/182International ClassificationB
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