| http://www.w3.org/ns/prov#value | - Although it is known in the art that dielectric layers may be planarized through methods including but not limited to Chemical Mechanical Polish (CMP) planarizing methods and Reactive Ion Etch (RIE) etch-back planarizing methods, for the first preferred embodiment of the method of the present invention, the blanket first Pre-Metal Dielectric (PMD) layer 22 is preferably planarized to simultaneousl
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