| http://www.w3.org/ns/prov#value | - Further, as shown in FIG. 1A, one of the electrodes, which is connected to the sub-mount 3 through wire-bonding using a gold wire 6 or the like, is connected to the first lead 11 from the rear surface thereof through the die pad 11 a by using a conductive adhesive or the like, with the other electrode (rear-surface electrode) being connected to the second lead 12 via a connecting portion 3 a on th
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