| http://www.w3.org/ns/prov#value | - For example, a solution including additives may be delivered to the surface 101 in streams or sprays depicted as arrows A in FIG. 8A. However, some of the nozzles 109 can be conveniently used to apply a cleaning or rinsing solution, such as de-ionized water, on the wafer W before and/or after the plating process.
|
