| http://www.w3.org/ns/prov#value | - A method of forming a semiconductor connection component comprising the steps of:(a) providing a dielectric layer with a slot therein; (b) providing a metallic structure including terminals disposed on the dielectric layer on one side of the slot, a plating bus line disposed on the other side of the slot, and leads extending from the terminals across the slot to the plating bus; (c) applying resis
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