About: http://webisa.webdatacommons.org/40817662

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In addition, when sealing the semiconductor chips 23 a through 23 d by the sealing resin 27, a molding using a thermosetting resin such as an epoxy resin can be conducted, for example.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com