| http://www.w3.org/ns/prov#value | - In the above-mentioned invention, the dielectric board 2 of the high-frequency package 1 and the insulating board 24 of the external circuit board 23 are made of ceramics such as alumina (Al2 O3), glass ceramics, aluminum nitride (AlN), mullite, silicon nitride (Si3 N4), or a known insulating material such as an organic insulating material containing an organic resin.
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