About: http://webisa.webdatacommons.org/438350161

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In addition, when sealing the semiconductor chips 43 a through 43 c and 53 a through 53 c by the sealing resin 47 and 57, respectively, a molding using a thermosetting resin such as an epoxy resin can be conducted.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com