| http://www.w3.org/ns/prov#value | - Such a resin-coveredchip will be described below with reference to FIGS. 8 and 9.The resin-covered chip 14 is formed by covering each of the devices 12, which are held on the first temporarily holding member such as to be spaced from each other, with the resin 13 and curing the resin 13.
|
