| http://www.w3.org/ns/prov#value | - cond cap member secured to said lead frame and cooperating with said first cap member to define a cavity including said die location; and (c) an electronic circuit chip comprising;(i) a first body of semiconductor material having circuit components formed therein with terminal input/output pads on at least one surface thereof; (ii) a second body of semiconductor material of the same composition as
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