PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • If the die pad 32 and contact 30 are formed through other deposition processes such as sputtering, evaporation or other processes, the thin metal layer 57 may not be necessary.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com