| http://www.w3.org/ns/prov#value | - Then, the assembling substrate 23 having the prescribed semiconductor chip 2a set in place and packaged on the first main surface and destined to form the substrate 18 is set in place and disposed in the depressed part 8b of the lower metallic mold 8 and the tablet 5a of such thermosetting resin as epoxy resin is meanwhile set in place.
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