About: http://webisa.webdatacommons.org/76507843

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In addition, when sealing the semiconductor chips 23 a-23 c and 33 a-33 c by the sealing resin 27 and 37, respectively, molding which uses a thermosetting resin, such as an epoxy resin, can be carried out.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com