| http://www.w3.org/ns/prov#value | - r surface of the die pad 146 is smooth, but the central portion on the lower surface may be recessed upward. [0222] The processing of the lead frame of this embodiment is performed by etching. [0223] Next, FIG. 41A is a plan view of the resin-encapsulated semiconductor device of this embodiment when viewed from the bottom.
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