About: http://webisa.webdatacommons.org/79742186

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Because solder alloys cannot wet or bond to semiconductor materials such as silicon and ceramics, solder wafer bonding requires solderable bond pads adhered to each wafer and to which the solder will metallurgically bond.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com