| http://www.w3.org/ns/prov#value | - e of the semiconductor substrate over the whole length of the bottom to form a groove for attaining non-conduction between the lower end of the light emitting portion and the lower end of the reinforcing portion; the step of filling the recessed portion including the groove with an insulating material; the step of forming a contact hole in the insulating material so that the contact hole verticall
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