| http://www.w3.org/ns/prov#value | - The resin used therein is, similarly to the case of FIG. 5( a), an epoxy resin of low thermal expansion coefficient in which a quartz filler and rubber such as a silicone rubber are dispersed and which can reduce thermal impacts, or a silicone resin, or a resin in which the two of the resins are mixed in some states or forms.
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