| http://www.w3.org/ns/prov#value | - FIG. 3 is a schematic plan view of the apparatus. [0025] This heat treating apparatus includes a heat treating chamber 65 having a translucent plate 61, a bottom plate 62 and a pair of side plates 63 and 64 for receiving and heat treating a semiconductor wafer W. The translucent plate 61 acting as part of the heat treating chamber 65 is formed of an infrared transmitting material such as quartz.
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