{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/106344164"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "of an exemplary method used to fabricate the semiconductor package of the first embodiment shown in FIGS. 2A and 2B; FIG. 10 is a top plan view of a leadframe used to fabricate a semiconductor package constructed in accordance with a fifth embodiment of the present invention; FIG. 11A is a cross-sectional view of the semiconductor package of the fifth embodiment; FIG. 11B is a bottom plan view of" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/333602043"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/106344164"] } } }
