{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/1687067"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "According to a third aspect of the present invention, there is provided a semiconductor element-mounting board according to the first or second aspect, wherein the conductive member is formed of any one metal selected from a group consisting of Cu, Au, Al, Ag, Pd, and Pt, or an alloy mainly composed of one of the metals." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/239734529"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/1687067" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/239736909"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/1687067" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/239736924"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/1687067" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/372832037"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/1687067"] } } }
