{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/179165731"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "FIELD OF THE INVENTIONThe present invention relates generally to circuit modules, and more specifically, to a lead-frame interconnect circuit module method and assembly.BACKGROUND OF THE INVENTIONCircuit modules or cards are increasing in use to provide storage and other electronic functions for devices such as digital cameras, personal computing devices and personal digital assistants (PDAs)." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "patentgenius.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/448273815"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/179165731"] } } }
