{ "items" : [
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        "http://www.w3.org/ns/prov#value" : [ "One embodiment of the present invention is a method of constructing an RFID unit comprising placing a integrated circuit chip module on a protective layer, wherein the protective layer includes an adhesive to hold the integrated circuit module; placing a conductive adhesive on at least portions of the integrated circuit chip module; and attaching the integrated circuit chip module to a substrate w" ] ,
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