{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/prov/137300572"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/266452887" ] } },

    { "id" : "http://webisa.webdatacommons.org/266452887"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Another aspect of the present invention is a method for forming a common ground for an electromechanical device, further comprising acts of: depositing a sacrificial layer, the sacrificial layer having a thickness; and etching a plurality of tooth regions into the sacrificial layer proximate a portion of the conducting layer, such that the tooth regions, in a final device, provide a reduced adhesi" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com"] } } }
