{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/281749712"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "The devices 22 in the form of the resin-covered chips 24, which have been transferred in the second substrate 25 in such a manner as to be sufficiently enlargedly spaced from each other, are then subjected to wiring." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/163438654"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/281749712"] } } }
