{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/prov/137300572"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/293920219" ] } },

    { "id" : "http://webisa.webdatacommons.org/293920219"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Broadly speaking the present invention is a method of forming an encapsulated array of solder balls on a first sample that may be bonded to contact pads on another sample, comprising the steps of: patterning a set of solder balls onto the first sample; coating the solder balls in a layer of an encapsulation material, where the encapsulation material substantially covers the set of solder balls dis" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.es"] } } }
