{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/prov/137300572"
      "properties" : {
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    { "id" : "http://webisa.webdatacommons.org/303748844"
      "properties" : {
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        "http://www.w3.org/ns/prov#value" : [ "The present invention is an optical semiconductor wafer inspection system and a method thereof characterized by obliquely illuminating a scratch, void or particle produced on the surface of a polished or ground insulating film at substantially the same velocity of light, detecting scattered light at the time of oblique illumination from the surface of an inspection target at different angles and t" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "faqs.org"] } } }
