{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/304575399"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "The method further includes forming a plurality of conductive pillars through the encapsulantand adjacent to the first semiconductor die, forming a first stepped interconnect structure over the encapsulant, and mounting a plurality of second semiconductor die within a plurality of openings in the first stepped interconnect structure.In another embodiment, the present invention is a method of makin" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "patentgenius.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/107830320"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/304575399" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/137300572"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/304575399"] } } }
