{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/306611290"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "hi, Ltd.Thick film resistor material and thermal head obtained therefromUS5231420 *Apr 25, 1990Jul 27, 1993Seiko Epson CorporationThermal print headUS5317341 *Jan 9, 1992May 31, 1994Rohm Co., Ltd.Thermal head and method of making the sameUS5367320 *Jan 24, 1992Nov 22, 1994Rohm Co., Ltd.Thermal head and system including the sameUS5373625 *Oct 15, 1991Dec 20, 1994Rohm Co., Ltd.Method for making ther" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/212044578"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/306611290"] } } }
