{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/prov/137300572"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/317802596" ] } },

    { "id" : "http://webisa.webdatacommons.org/317802596"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "l stack structure including at least one first device chip with a first plurality of input/output (I/O) pads and at least one second device chipwith a second plurality of I/O pads, and a common circuit board to which the wafer level stack structure is connected.Another exemplary embodiment of the present invention is a method of forming a system-in-package for containing a wafer level stack struct" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "patentgenius.com"] } } }
