{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/323560061"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "FIG. 6 is a schematic representation of the top view of the lead frame of the present invention, including conductor leads extending to center portion of the chip and positioning openings at both sides in the selvage area;" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/264762257"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/323560061"] } } }
